Fluon® LM-ETFE AH Series

Fluon® LM-ETFE AH series products are fluorinated resins with adhesive properties, making it possible to adhere to other materials by melting.
It can be applied directly without an adhesive agent or surface treatment as required by previous systems. Excellent adhesiveness of the two-layer system is efficiently achieved in only one step.

Fluon® LM-ETFE AH Series Functions and Features

Bonding ability

LM-ETFE AH series enable melt-bonding to other materials without special adhesives or surface treatments while maintaining LM-ETFE properties.


Melting point is as low as 225°C. It has lower viscosity over 240°C, so processing is possible at temperature 50°C lower than conventional ETFE.

Excellent heat resistance

It has a higher heat resistance than the ETFE resin, so it is usable over a wide temperature range from -200°C to 180°C. Continuous usage at 180°C is also possible. It also maintains stable electrical properties.

Fluon® LM-ETFE AH Series Usage

Desired properties such as anti stick, ETFE moldability and chemical resistance are the same as those of conventional ETFE.

Fluon® LM-ETFE AH Series Usage

The following is an introduction of the major uses of the Fluon® LM-ETFE AH Series.

 Laminated tubes with other plastic

Laminated tubes with other plastic

 Laminated films with other plastic

Laminated films with other plastic

Grade List

PhysicalMethodUnitsStandard typeCompound Grade
MFRASTM D3159 (297°C, 49 N)g/10 min2525256.5
Specific GravityASTM D792-1.781.781.81.77
Melting PointDSC°C240225240240
Tensile Strength at breakASTM D638Mpa493538
Tensile Elongation at breakASTM D638%420350400
Flexural ModulusASTM D790Mpa79012401240
Izod Impact Strength, 23°CASTM D259J/mNon-BreakNon-BreakNon-BreakNon-Break
Permeation rate (CE10, 60°C)JIS Z0208 (CUP)g×mm/m2×24 h2.62.0 2.0
Surface ResistivityAGCΩ/□--1.0 E+032.0 E+03
Surface Contact AngleHanging drop methoddegrees100106105

Inquiries about this Product

We also accept requests for samples, and consultations regarding introduction and verification support.