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Fluoropolymers' excellent "non-adhesiveness", "heat resistance", and "electrical properties" make it useful in semiconductor packaging mold release film and rewiring materials.

Fluon® ETFE Film

Fluon® ETFE Film is widely used as a cushioning/release film in semiconductor molding processes.

Fluon® ETFE Film is a high-performance fluoropolymer film manufactured by AGC from our raw material. Due to its excellent properties of heat resistance, chemical resistance, optical transparency, and non-adhesiveness, it has a wide variety of applications from electronics, aircrafts and solar cells to kitchen products and wallpaper.

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Due to its properties of “oil and water repellency”, “chemical resistance”, “insulation” and the like, it is currently used and suitable for “semiconductor packaging” applications.

Because CYTOP® has an amorphous structure, it can achieve extremely high transparency, and since it dissolves in an exclusive fluorine-based solvent, thin film coating is possible. Furthermore, it is a fluoropolymer with the characteristics including “transparency”, “low refractivity”, “electrical insulation”, “water and oil repellency”, and “chemical resistance”.

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