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Fluoropolymers' excellent "non-adhesiveness", "heat resistance", and "electrical properties" make it useful in semiconductor packaging mold release film and rewiring materials.
Fluon® ETFE Film
Fluon® ETFE Film is widely used as a cushioning/release film in semiconductor molding processes.
Fluon® ETFE Film is a high-performance fluoropolymer film manufactured by AGC from our raw material. Due to its excellent properties of heat resistance, chemical resistance, optical transparency, and non-adhesiveness, it has a wide variety of applications from electronics, aircrafts and solar cells to kitchen products and wallpaper.
Due to its properties of “oil and water repellency”, “chemical resistance”, “insulation” and the like, it is currently used and suitable for “semiconductor packaging” applications.
Because CYTOP® has an amorphous structure, it can achieve extremely high transparency, and since it dissolves in an exclusive fluorine-based solvent, thin film coating is possible. Furthermore, it is a fluoropolymer with the characteristics including “transparency”, “low refractivity”, “electrical insulation”, “water and oil repellency”, and “chemical resistance”.